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Dongguan Ziitek Electronic Materials & Technology Ltd.
Phase Changing Materials;Thermal Conductive Pad;Thermal Gap Filler
 
Your current location：Home » Sell » 2.5 W / mK Phase Changing Materials For Cache Chips High Thermal Conductive

2.5 W / mK Phase Changing Materials For Cache Chips High Thermal Conductive

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Title： 2.5 W / mK Phase Changing Materials For Cache Chips High Thermal Conductive 
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Unit price： Negotiable
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Quantity： Negotiable
Delivery date： Since the payment date Days delivery
Contact： Miss. Jor （Ms.）    
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2.5 W / mK Phase Changing Materials For IGBTs Cache Chips High Thermal Conductive

 

 

  The TIC™800A Series is low melting point thermal interface material. At 50, The TIC™800A Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™800A Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance. 


      The TIC™800A Series shows no thermal performance degradation after 1,000 hours@130,or after 500 cycles, from -25 to 125.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures. 

 


Features:


> 0.018-in² /W thermal resistance
> Naturally tacky at room temperature, no adhesive required             
> No heat sink preheating required 


Applications:


> High Frequency Microprocessors

> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs

 

Typical Properties of TIC™800A Series
Product Name
2.5 W / mK Phase Changing Materials For Cache Chips High Thermal Conductive
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