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Dongguan Ziitek Electronic Materials & Technology Ltd.
Phase Changing Materials;Thermal Conductive Pad;Thermal Gap Filler
 
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Void Free Surface Thermal Conductive Adhesive 1.3W / mK for Power Modules / IGBT / Computer

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Title： Void Free Surface Thermal Conductive Adhesive 1.3W / mK for Power Modules / IGBT / Computer 
Brand： -
Model： -
Unit price： Negotiable
MOQ： -0 -
Quantity： Negotiable
Delivery date： Since the payment date Days delivery
Contact： Miss. Jor （Ms.）    
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Void Free Surface Thermal Conductive Adhesive 1.3W / mK for Power Modules / IGBT / Computer


Void Free Surface Thermal Conductive Adhesive 1.3W / mK for Power Modules / IGBT / Computer
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